The Hhfac adsorption step is the rate-determining-step in the chelation process of chlorinated cobalt surfaces. What state of matter is depicted in each bin tightly packed and hardly moving solid moving around fast and freely gas slightly moving but not much liquid Classify each type of matter as an element, a compound, a heterogeneous mixture, or a homogeneous mixture. In the following drawings, red and blue spheres represent atoms of different elements. (b) Write a balanced equation for the reaction. (a) Write the chemical formulas for the reactants and products. The final reaction product of the chelation reaction is suggested to be CoCl 2(hfac). The following diagram represents a chemical reaction in which the red spheres are oxygen atoms and the blue spheres are nitrogen atoms. Density functional theory calculations showed that the adsorption of Hhfac on the chlorinated Co surface is the rate-determining-step in the chelation process of chlorinated cobalt surfaces. The EPC of Co increased from 1.1 to 2.1 nm as the chlorination time increased from 30 to 90 s however, it saturated with increasing Hhfac exposure time. The box on the left represents the reactants at the instant of mixing, and the box on the right shows what is left once the reaction has gone to completion. (Green balls represent B atoms and orange balls are A atoms). Smallest is Mg2+ Ca atom will be larger than Ca2+ because cations are smaller than their parent atom. 4.68 The pictures below show a molecular-scale view of a chemical reaction between the compounds AB2 and B2. 7.30 Consider the following spheres: Which one represents Ca, which Ca2+, and which Mg2+ Largest is Ca atom. Above 200 ☌, the EPC of Co decreased owing to Hhfac decomposition at high process temperatures. larger than their parent atom, the second (blue) sphere will be the nonmetal atom. Base your answers to questions through on the information below and on your knowledge of chemistry. In the chelation step, CoCl 2 was removed from the surface by forming a volatile etch product at temperatures ≥ 150 ☌, and the Etch per cycle (EPC) of Co was constant in the temperature range of 150–175 ☌. The Co surface was chlorinated with BCl 3 plasma to form CoCl 2 in the plasma chlorination step, and the thickness of CoCl 2 was measured using secondary ion mass spectrometry. In this study, a thermal atomic layer etching process for Co comprising two steps––plasma chlorination and chelation with hexafluoroacetylacetone (Hhfac)––was developed.
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